Bonding behavior of copper thick films containing lead-free glass frit on aluminum nitride substrates

Ceramics International

Volumn 30, Issue 5, 2004, Pages 661-665

  Xu, Xinrui ^a   Zhuang, Hanrui ^a   Li, Wenlan ^a   Jiang, Guojian ^a  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

Author keywords

Adhesion strength; Aluminum nitride; Copper thick films; E. Substrates

Indexed keywords

ADHESION; ALUMINUM COMPOUNDS; BONDING; COPPER; LEAD; OXIDATION; SINTERING; SUBSTRATES; SURFACE TREATMENT;

ADHESION STRENGTH; BONDING AGENTS; COPPER THICK FILMS; GLASS SYSTEMS;

THICK FILMS;

EID: 2942617269     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2003.07.012     Document Type: Article

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