Investigation of Ta grain boundary diffusion in copper by means of Auger electron spectroscopy

Thin Solid Films

Volumn 459, Issue 1-2, 2004, Pages 303-307

  Erdelyi G ^a   Langer, G ^a   Nyeki J ^a   Kover L ^b   Tomastik, C ^c   Werner, W S M ^c   Csik, A ^b   Stoeri, H ^c   Beke, D L ^a  

^a UNIVERSITY OF DEBRECEN   (Hungary)

^b INSTITUTE OF EXPERIMENTAL MEDICINE   (Hungary)

^c VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

Auger electron spectroscopy; Cu Ta thin film; Diffusion barrier; Grain boundary diffusion

Indexed keywords

ALUMINUM ALLOYS; AUGER ELECTRON SPECTROSCOPY; COPPER; DIFFUSION; GRAIN BOUNDARIES; HEAT TREATMENT; METALLIZING; SURFACE TREATMENT; TANTALUM;

DIFFUSION BARRIERS; GRAIN BOUNDARY DIFFUSION;

THIN FILMS;

EID: 2942615154     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2003.12.125     Document Type: Conference Paper

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