a-Si:H alloy for stress sensor application

Journal of Non-Crystalline Solids

Volumn 338-340, Issue 1 SPEC. ISS., 2004, Pages 725-728

  Caputo, D ^a   De Cesare, G ^a   Gavesi, M ^b   Palma, F ^a  

^a SAPIENZA UNIVERSITY OF ROME   (Italy)

^b UNIVERSITY OF BOLOGNA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); INTEGRATED CIRCUITS; INTEGRATION; SENSITIVITY ANALYSIS; SENSORS; STRESS ANALYSIS; TORSIONAL STRESS;

FIXING PROCEDURES; STRESS MEASUREMENTS; STRESS SENSORS; TORSION FORCES;

SILICON ALLOYS;

EID: 2942564115     PISSN: 00223093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jnoncrysol.2004.03.077     Document Type: Article

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