Integration of CMP with low-k materials

Semiconductor International

Volumn 25, Issue 6, 2002, Pages 115-122

  Block, Kelly H ^a   Rayle, Heather L ^b  

^a ROHM AND HAAS COMPANY   (United States)

^b Rodel Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL PLANARIZATION (CMP); PLANARIZATION INTERLAYER DIELECTRIC (ILD); REMOVAL RATES; SPIN-ON DIELECTRICS (SOD);

CHEMICAL POLISHING; DATA ACQUISITION; HARDNESS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POROUS MATERIALS; SILICON WAFERS; THERMAL EXPANSION; THICKNESS MEASUREMENT;

DIELECTRIC MATERIALS;

EID: 2942539713     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

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