MRI and implanted medical devices: Basic interactions with an emphasis on heating

IEEE Transactions on Device and Materials Reliability

Volumn 5, Issue 3, 2005, Pages 467-479

  Nyenhuis, John A ^a,b,e,f,g,h   Park, Sung Min ^b   Kamondetdacha, Rungkiet ^b,e   Amjad, Arslan ^b   Shellock, Frank G ^c,f,i,j,k   Rezai, Ali R ^d,j,l  

^a IEEE   (United States)

^b PURDUE UNIVERSITY   (United States)

^c UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

^d LERNER RESEARCH INSTITUTE   (United States)

^e Purdue University   (United States)

^f National Federation of Independent Business   (United States)

^g International Electrical Commission Working Group   (United States)

^h American Institute for Medical and Biological Engineering   (United States)

ⁱ Education   (United States)

^j American College of Radiology ^*  (United States)

^k American College of Radiology   (United States)

^l Congress of Neurological Surgeons ^*  (United States)

more..

Author keywords

Heating; Implant; Magnetic resonance imaging (MRI); Radio frequency (RF); Safety

Indexed keywords

ELECTRICAL INFERENCE; FERROMAGNETIC OBJECTS; IMPLANT; STATIC FIELD;

ACCIDENT PREVENTION; AUDIO FREQUENCY AMPLIFIERS; BIOMEDICAL EQUIPMENT; FERROMAGNETIC MATERIALS; MAGNETIC FIELDS; RADIOFREQUENCY SPECTROSCOPY; TISSUE;

MAGNETIC RESONANCE IMAGING;

EID: 29344433261     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2005.859033     Document Type: Article

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