Studies on thermal and mechanical properties of PI/SiO2 nanocomposite films at low temperature

Composites Part A: Applied Science and Manufacturing

Volumn 37, Issue 1, 2006, Pages 74-79

  Wang, Zheng Dao ^a   Lu, Jian Jun ^a   Li, Y ^b   Fu, S Y ^b   Jiang, Shao Qing ^a   Zhao, Xin Xin ^a  

^a BEIJING JIAOTONG UNIVERSITY   (China)

^b TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

Author keywords

B. Mechanical properties; Polyimide Film

Indexed keywords

ELASTIC MODULI; PLASTIC FILMS; POLYIMIDES; SILICA; TENSILE STRENGTH; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION (CTE); POLYIMIDE FILM; ROOM TEMPERATURE; STRESS LEVEL;

NANOSTRUCTURED MATERIALS;

EID: 29244461426     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2005.04.018     Document Type: Article

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