New lead free technology for high temperature mechatronics

VDI Berichte

Volumn , Issue 1646, 2001, Pages 729-735

  Martin, G M ^b   Le Meau, M ^b   Henry, K ^a   Goguet, O ^b   Maillet, R ^a  

^a VALEO   (France)

^b VALEO Electrical Systems ^*

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC SUBSTRATES; ELECTRONIC CONTROLS; ELECTRONIC DEVICE PACKAGING; LEAD FREE ALLOYS;

CERAMIC MATERIALS; CONTROL SYSTEMS; DIES; ELECTRONIC EQUIPMENT; HIGH TEMPERATURE EFFECTS; MELTING; PACKAGING MATERIALS; PRINTED CIRCUIT BOARDS; SUBSTRATES; TIN ALLOYS;

MECHATRONICS;

EID: 4444316480     PISSN: 00835560     EISSN: None     Source Type: Book Series    
DOI: None     Document Type: Article

References (8)

1. /1/ G. WHITTEN, Proceedings of the Elec. Comp. & Tech. IEEE conference, 2000
2. /2/ A.Z. MIRIC, A. GRUSD, soldering & surface Mount Technology, 10/1, 1998.
3. /3/ B. HAMPSHIRE, Soldering and Mounting Technology, p 633.
4. /4/ S.K. KANG, R.S. RAI, S. PURUSHOTHAMAN, Journal of Electronic Materials, Vol. 25, No. 7, 1996.
5. /5/ R.J.K. WASSINK, Soldering in Electronics, 1989.
6. /6/ J. PHILIBERT, diffusion and mass transport in solids, 1989.
7. /7/ T.F. MARINIS, R.C. REINERT, Isothermal ageing characteristics of external lead solder connections, IEEE, 1985.
8. /8/ N.ANDRE, P.G. HARRIS, K.S. CHAGGAR, G. KELLY, Brasage sans plomb : situation actuelle, ITRI.