Integrated chip-size antennas for wireless microsystems: Fabrication and design considerations

Sensors and Actuators, A: Physical

Volumn 125, Issue 2, 2006, Pages 217-222

  Mendes, P M ^a,b   Polyakov, A ^b   Bartek, M ^b,c   Burghartz, J N ^b,d   Correia, J H ^a  

^a UNIVERSITY OF MINHO   (Portugal)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^d Laboratory of High Frequency Technology and Components (HiTeC)   (Netherlands)

Author keywords

Chip size antenna; Excimer laser ablation; Via fabrication; Wafer level packaging; Wireless microsystem

Indexed keywords

CHIP-SIZE ANTENNA; EXCIMER LASER ABLATION; VIA FABRICATION; WAFER-LEVEL PACKAGING; WIRELESS MICROSYSTEM;

BANDWIDTH; CHIP SCALE PACKAGES; EXCIMER LASERS; FABRICATION; GLASS; LASER ABLATION; LOGIC DESIGN; MICROPROCESSOR CHIPS; WIRELESS TELECOMMUNICATION SYSTEMS;

ANTENNAS;

EID: 29144515426     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2005.07.016     Document Type: Article

References (11)

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