Full wafer simulation of immersion fluid heating

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 23, Issue 6, 2005, Pages 2596-2600

  El Morsi, M ^a   Nellis, G ^a   Schuetter, S ^a   Van Peski, C ^b   Grenville, A ^b  

^a University of Wisconsin Madison   (United States)

^b SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLUID HEATING; IMMERSION FLUID; THERMAL ASPECTS;

ABSORPTION; HEATING; LENSES; REFRACTIVE INDEX; SILICON WAFERS;

LITHOGRAPHY;

EID: 29044450419     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2091091     Document Type: Article

References (8)

1. M. Switkes and M. Rothschild, J. Microlith., J. Microlithogr., Microfabr., Microsyst. 1, 225 (2002).
2. A. Wei, M. El-Morsi, G. Nellis, A. Abdo, and R. Engelstad, J. Vac. Sci. Technol. B 22, 3444 (2004).
3. G. Nellis, M. El-Morsi, C. Van Peski, and A. Grenville (unpublished).
4. F. P. Incropera and D. P. DeWitt, Introduction to Heat Transfer, 4th ed. (Wiley, New York, 2002), 779 pp.
5. S. Baek, A. Wei, D. Cole, G. Nellis, M. Yeung, A. Abdo, and R. Engelstad, Proc. SPIE 5377, 415 (2004).
6. J. Burnett, S. Kaplan, and J. Fuller, ISMT 2004 Immersion Lithography Workshop, Los Angeles, CA, January 27, 2004.
7. J. Chang, Ph.D. dissertation, Mechanical Engineering, University ofWisconsin, Madison, WI, 2003.
8. A. Wei, Ph.D. dissertation, Mechanical Engineering, University ofWisconsin, Madison, WI, 2004.