Predicting air entrainment due to topography during the filling and scanning process for immersion lithography

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 6, 2004, Pages 3444-3449

  Wei, A ^a   Ei Morsi, M ^a   Nellis, G ^a   Abdo, A ^a   Engelstad, R ^a  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR BUBBLES; MACROSCOPIC FLOW; VOLUME-OF-FLUID (VOF); WAFER TOPOGRAPHY;

AIR ENTRAINMENT; BUBBLES (IN FLUIDS); COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; LENSES; OPTICAL RESOLVING POWER; REFRACTIVE INDEX; SCANNING;

PHOTOLITHOGRAPHY;

EID: 13244255761     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1808736     Document Type: Conference Paper

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