Mapping of industry building product model for detailed thermal simulation and analysis

Advances in Engineering Software

Volumn 37, Issue 3, 2006, Pages 133-145

  Lam, K P ^a   Wong, N H ^a   Shen, L J ^a   Mahdavi, A ^b   Leong, E ^c   Solihin, W ^c   Au, K S ^d   Kang, Z ^d  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^c Novacitynets Pte Ltd   (Singapore)

^d TEMASEK POLYTECHNIC   (Singapore)

Author keywords

Industry foundation class (IFC); Mapping; Product model; Thermal simulation

Indexed keywords

ARCHITECTURAL DESIGN; BUILDINGS; COMPUTER SIMULATION; INTEROPERABILITY; MAPPING; THERMOANALYSIS; XML;

DATA DUPLICATION; INDUSTRY FOUNDATION CLASS (IFC); PRODUCT MODELS; THERMAL SIMULATION;

INDUSTRIAL PLANTS;

EID: 28844435939     PISSN: 09659978     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.advengsoft.2005.05.005     Document Type: Article

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