Pattern based mask process correction - Impact on data quality and mask writing time

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5853 PART II, Issue , 2005, Pages 564-573

  Sahouria, Emile ^a   Bowhill, Amanda ^a   Schulze, Steffen ^a  

^a MENTOR GRAPHICS CORPORATION   (United States)

Author keywords

Data quality; Fogging effect; Fracturing; Mask Process Correction; VSB

Indexed keywords

BOUNDARY CONDITIONS; DATA ACQUISITION; ETCHING; LITHOGRAPHY; SEMICONDUCTOR MATERIALS;

DATA CORRECTION METHODS; MASK PROCESS EFFECT;

MASKS;

EID: 28544432489     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.617133     Document Type: Conference Paper

References (7)

1. Chris A. Mack "Measuring and Modeling Flare in Optical Lithography"
2. S.H. Yang, Y.H. Choi, J.R. Park, Y. H. Kim, S. W. Choi, J.M. Sohn "Proximity Effect Correction Optimization Considering Fogging and Loading Effects Compensation", Proc. SPIE Vol. 4689
3. U. Hofmann, C. Kalus, A. Rosenbusch, R. Jonckheere, A. Hourd, "Hierarchical E-beam Proximity Correction in Mask Making", Proc. of SPIE 2723
4. J. Schneider, M.Bloecker, G. Ballhorn, N. Belic, H. Eisenmann, D. Keogan "Correction of long-range process effects on photomasks by design data correction", Proc. of SPIE, Bacus 2003
5. J. Kotani, T. Yanagiharab, E. Umedaa, T. Senoua, Y. Kikuchia, T. Tanakaa, Y. Okudaa, "Mask CD uniformity improvement by dry etching loading effect correction", Proc. of SPIE, Bacus 2004
6. S. Schulze, E.Sahouria, "The prospects for hierarchical processing with growing complexity of the post tapeout flow", Proc. SPIE 5756, SPIE 2005
7. S. Schulze, E.Sahouria, E. Miloslavsky, "High performance fracturing for variable shaped beam mask writing machines", Proc. SPIE 5130, PMJ 2003