Wire-bonding process monitoring using thermopile temperature sensor

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 4, 2005, Pages 685-693

  Suman, Shivesh ^a   Gaitan, Michael ^b   Joshi, Yogendra ^a   Harman, George G ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

CMOS compatible microelectromechanical system (MEMS); In situ process monitoring; Seebeck effect; Thermopile temperature sensor; Thermosonic ball bonding

Indexed keywords

BONDING; FINITE ELEMENT METHOD; IN SITU PROCESSING; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; MICROSENSORS; SEEBECK EFFECT; SIGNAL TO NOISE RATIO; TEMPERATURE MEASUREMENT; THERMOPILES;

CMOS COMPATIBLE MEMS; IN SITU PROCESS MONITORING; THERMOPILE TEMPERATURE SENSOR; THERMOSONIC BALL BONDING;

CMOS INTEGRATED CIRCUITS;

EID: 28444454085     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.848696     Document Type: Article

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