Bondability analysis of bond pads by thermoelectric temperature measurements

Journal of Electronic Materials

Volumn 27, Issue 11, 1998, Pages 1254-1261

  Schneuwly, A ^a   Groning P ^a   Schlapbach, L ^a   Muller G ^b  

^a UNIVERSITY OF FRIBOURG   (Switzerland)

^b Oerlikon Assembly Equipment AG   (Switzerland)

Author keywords

Au wire bonding; Au Ni thermocouple; Friction; Heat dissipation; Plasma cleaning; Thermoelectric temperature

Indexed keywords

BONDING; HEAT LOSSES; TEMPERATURE MEASUREMENT; THERMOCOUPLES; THERMOELECTRICITY;

PLASMA CLEANING;

GOLD ALLOYS;

EID: 0032208232     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0079-2     Document Type: Article

References (24)

1. J.E. Krzanowski and N. Murdeshwar, J. Electron. Mater. 19, 919 (1990).
2. G. Harman, Wire bonding in microelectronics, ISHM technical monograph series (1989).
3. K.H. Ernst, D. Grman and R. Hauert, Surf. and Interface Analysis 21, 691 (1994).
4. A. Schneuwly, P. Gröning and L. Schlapbach, J. Electron. Mater., to be published.
5. N. Onda, A. Dommann, H. Zimmermann, C. Lüchinger, V. Jaecklin, D. Zanetti, E. Beck and J. Ramm, Semicon Singapore Proc. (1996).
6. E. Wandtke, Transfer 40, 34 (1996).
7. J.A. DiGirolamo, Electronic Packaging & Production 3 (1991).
8. K. Seshan and S.K. Ray, IEEE/CHMT Intl. Electronic Manufacturing Technology Symp. Proc., (New York: IEEE, 1986), p. 109.
9. J. Onuki, M. Koizumi and O. Yoshioka, Mater. Trans. JIM 34, 976 (1993).
10. E. Viloria, J. Electron. Manu. 4, 217 (1994).
11. M.F. Ashby, J. Abulawi and H.S. Kong, STLE Tribology Trans., October (1991).
12. I.L. Singer, J. Vac. Sci. Technol. A 12, 2605 (1994).
13. G. Binnig, C.F. Quate and C. Gerber, Phys. Rev. Lett. 56, 930 (1986).
14. C.M. Mate, G.M. McClelland, R. Erlandson and S. Chiang, Phys. Rev. Lett. 59, 1942 (1987).
15. G. Meyer and N.M. Amer, Appl. Phys. Lett. 56, 2100 (1990).
16. J.N. Israelachvili, P.M. McGuiggan and A.M. Homola, Sci. 240, 189 (1988).
17. S. Granick, Sci. 253, 1374 (1991).
18. P. Gröning, A. Schneuwly and L. Schlapbach, to be submitted.
19. S. Nowak, P. Gröning, O.M. Küttel, M. Collaud and G. Dietler, J. Vac. Sci. Technol. A 10, 3419 (1992).
20. T.D. McGee, Principles and Methods of Temperature Measurement, (New York: John Wiley & Sons, 1988).
21. E.A. Brandes, Smithells Metals Reference Book, 6 Ed., (London: Butterworths, 1983).
22. V.P. Jaecklin, Semicon Singapore-Test. Assembly & Packaging 95, Singapore 208 (1995).
23. A. Carras and V.P. Jaecklin, DVS (Deutscher Verband für Schweisstechnik) 173, 135 (1995).
24. V.P. Jaecklin, S. Arsalane, D. von Flüe, H. Egger and Z. Stössel, VLSI Packaging Workshop, Monterey, CA, USA (1995).