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11th IEEE International Conference on Advanced Thermal Processing of Semiconductors, RTP 2003

Volumn , Issue , 2003, Pages 125-129

Lightpipe proximity effects on Si wafer temperature in rapid thermal processing tools

(5) Kreider, K G a Chen, D H a DeWitt, D P a Kimes, W A a Tsai, B K a

a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; HEAT FLUX; HEAT TREATMENT; RAPID THERMAL PROCESSING; REFLECTION; SAPPHIRE; TEMPERATURE SENSORS; THERMOCOUPLES;

RADIATION THERMOMETERS; RADIATIVE PROPERTIES; SEMI-CONDUCTOR FABRICATION; SEPARATION DISTANCES; SPECTRAL RADIANCE TEMPERATURE; TEMPERATURE DEPRESSION; TEMPERATURE MONITORING; THIN FILM THERMOCOUPLE;

SILICON WAFERS;

EID: 28344454128 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/RTP.2003.1249133 Document Type: Conference Paper

Times cited : (11)

References (8)

1
- 0037877295
- Characterization of Lightpipe Radiation Thermometers for the NIST test Bed
- Gaithersburg, MD
- Tsai, B. K., Meyer, C. W., and Lovas, F. J., "Characterization of Lightpipe Radiation Thermometers for the NIST test Bed," in 8th International Conference on Advanced Thermal Processing of Semiconductors, Gaithersburg, MD (2000).
- (2000) 8th International Conference on Advanced Thermal Processing of Semiconductors
- Tsai, B.K.¹ Meyer, C.W.² Lovas, F.J.³

2
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- Effects of Extraneous Radiation on the Performance of Lightpipe Radiation Thermometers
- B. Fellmuth, J. Seidel and Gunther Scholz Eds., Berlin, VDE Verlag GMBH
- Meyer, C. W., "Effects of Extraneous Radiation on the Performance of Lightpipe Radiation Thermometers" in Proceedings of TEMPMEKO 2001, B. Fellmuth, J. Seidel and Gunther Scholz Eds., Berlin, VDE Verlag GMBH, 2002, 937-942.
- (2002) Proceedings of TEMPMEKO 2001 , pp. 937-942
- Meyer, C.W.¹

3
- 0031620922
- RTP Calibration Wafer Using Thin-film Thermocouples
- M. Ozturk, et al., Ed. MRS, Pittsburgh, PA
- Kreider, K. G., DeWitt, D. P., Tsai, B. K., Lovas, F. J., and Allen, D. W. "RTP Calibration Wafer Using Thin-film Thermocouples", in Rapid Thermal and Integrated Processing VII, M. Ozturk, et al., Ed. MRS, Pittsburgh, PA, 1998, pp. 87-94.
- (1998) Rapid Thermal and Integrated Processing VII , pp. 87-94
- Kreider, K.G.¹ DeWitt, D.P.² Tsai, B.K.³ Lovas, F.J.⁴ Allen, D.W.⁵

4
- 0034317769
- Kreider, K. G. and Gillen, G. J., Thin Solid Films, 376, 32-37 (2000).
- (2000) Thin Solid Films , vol.376 , pp. 32-37
- Kreider, K.G.¹ Gillen, G.J.²

5
- 48349115288
- Temperature Calibration Wafer for Rapid Thermal Processing Using Thin-film Thermocouples
- U.S. Patent Mar. 14
- Kreider, K.G. "Temperature Calibration Wafer for Rapid Thermal Processing Using Thin-film Thermocouples" U.S. Patent 6,037,645, Mar. 14, 2000.
- (2000)
- Kreider, K.G.¹

6
- 2942637672
- Calibration of Thin-film Thermocouples on Silicon Wafers
- June IMEKO, Delft, NL
- th Int'l Symp. on Temperature and Thermal Measurements in Industry and Science, June 1999, IMEKO, Delft, NL. pp. 286-291.
- (1999) th Int'l Symp. on Temperature and Thermal Measurements in Industry and Science , pp. 286-291
- Kreider, K.G.¹ Ripple, D.C.² DeWitt, D.P.³

7
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- Rapid Thermal Processing Technologies III, P. J. Timans, et al. Ed. Sept.
- Kreider, K. G, Chen, D. C, DeWitt, D. P, Kimes, W. A, Meyer, C. W, and Tsai, B. K, in Rapid Thermal Processing Technologies III, P. J. Timans, et al. Ed. ECS Proceedings Vol. 2002-11, Sept. 2002, pp 273-281.
- (2002) ECS Proceedings , vol.2002 , Issue.11 , pp. 273-281
- Kreider, K.G.¹ Chen, D.C.² DeWitt, D.P.³ Kimes, W.A.⁴ Meyer, C.W.⁵ Tsai, B.K.⁶

8
- 84954172562
- D. Ripple et al. Ed., AIP, N.Y, in press
- th Symp. on Measurement and Control in Science and Industry, D. Ripple et al. Ed., AIP, N.Y, in press.
- th Symp. on Measurement and Control in Science and Industry
- Kreider, K.G.¹ Kimes, W.A.² Meyer, C.W.³ Ripple, D.C.⁴ Tsai, B.K.⁵ Chen, D.C.⁶ DeWitt, D.P.⁷

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.