Nanoindentation: A suitable tool to determine local mechanical properties in microelectronic packages and materials?

Archive of Applied Mechanics

Volumn 74, Issue 11-12, 2005, Pages 728-738

  Albrecht, H J ^a   Hannach, T ^b   Hase A ^b   Juritza, A ^b   Muller K ^c   Muller W H ^b  

^a SIEMENS AG   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^c Neue Materialien Bayreuth GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INDENTATION; INTERMETALLICS; MECHANICAL PROPERTIES; SURFACE TENSION;

FINITE ELEMENT (FE) SIMULATIONS; INTERMETALLIC PHASES; MICROELECTRONIC PACKAGES; NANOINDENTATION;

MICROELECTRONICS;

EID: 28344449334     PISSN: 09391533     EISSN: 14320681     Source Type: Journal    
DOI: 10.1007/s00419-005-0394-5     Document Type: Conference Paper

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