Characterization of flip chip microjoins up to 40 GHz using silicon carrier

Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC

Volumn , Issue , 2005, Pages 129-131

  Patel, Chirag S ^a   Andry, Paul S ^a   Jenkins, Keith A ^a   Dang, Bing ^b   Horton, Raymond ^a   Polastre, Robert J ^a   Tsang, Cornelia K ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FREQUENCY DOMAIN; MICROJOINS; TRANSMISSION LOSSES;

COPPER; ELECTRIC LINES; LARGE SCALE SYSTEMS; SILICON;

FLIP CHIP DEVICES;

EID: 28244497754     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. C. Liu, D. A. Hutt, D. C. Whalley, P. P. Conway, and S. H. Mannan, "Under bump metallisation of fine pitch flip-chip using electroless nickel deposition," J. of Electronics Mfg., vol. 10, no.3, pg. 161-170, 2000.
2. U. Kang, Y. Kim, "Electrical characteristics of fine pitch flip chip solder joints fabricated using low temperature solders," 54th ECTC, pg. 1052-1958, June 2004.
3. B. Pahl, T. Locher, C. Kallmayer, R. Aschenbrenner, H. Reichl, "Ultrathin soldered flip chip interconnections on flexible substrates," 54th ECTC, pg. 1244-1250, June 1-4, 2004.
4. http://pr.fujitsu.com/en/news/2003/12/15.html, "World's first 35 micron-pitch solder bumping and successful interconnection," Fujitsu press release, December 2003.