Finite element modelling of a BGA package subjected to thermal and power cycling

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 993-1000

  Rodgers, B ^a   Punch, J ^a   Jarvis, J ^a   Myllykoski, Pirkka ^b   Reinikainen, Tommi ^c  

^a UNIVERSITY OF LIMERICK   (Ireland)

^b NOKIA RESEARCH CENTER   (United States)

^c NOKIA RESEARCH CENTER   (United States)

Author keywords

Capacitive sensors; Electronics packaging; Fatigue; Finite element methods; Isothermal processes; Life estimation; Power generation; Soldering; Temperature; Thermal loading

Indexed keywords

CAPACITIVE SENSORS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEAT GENERATION; INTERMETALLICS; ISOTHERMS; POWER GENERATION; SOLDERED JOINTS; SOLDERING; STRAIN ENERGY; TEMPERATURE; THERMAL LOAD;

CRACK GROWTH DATA; FINITE ELEMENT MODELLING; FINITE ELEMENT TECHNIQUES; ISOTHERMAL PROCESS; ISOTHERMAL TEMPERATURE; LIFE ESTIMATION; THERMAL LOADINGS; VISCOPLASTIC STRAINS;

FATIGUE OF MATERIALS;

EID: 4444343163     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012565     Document Type: Conference Paper

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