Flip-chip package with a heat spreader for high power dissipation LSI chips

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 227-231

  Ando, Hideko ^a   Kikuchi, Hiroshi ^a   Sato, Toshihiko ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; HEAT RESISTANCE; INTEGRATED CIRCUIT LAYOUT; LSI CIRCUITS; PRINTED CIRCUIT BOARDS; THERMAL CONDUCTIVITY;

CERAMIC BALL GRID ARRAY; HEAT CYCLE TEST; HEAT SPREADER; POWER DISSIPATION;

ELECTRONICS PACKAGING;

EID: 0032651053     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)