Thermoanalytical characterization of thermoset polymers for chemical mechanical polishing

Thermochimica Acta

Volumn 439, Issue 1-2, 2005, Pages 44-51

  Tregub, A ^a   Ng, G ^a   Sorooshian, J ^a   Moinpour, M ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Chemical mechanical planarization; Pad; Thermal analysis

Indexed keywords

CHEMICAL MECHANICAL POLISHING; HEAT TREATMENT; THERMOANALYSIS; THERMOGRAVIMETRIC ANALYSIS;

CHEMICAL MECHANICAL PLANARIZATION (CMP); PAD; THERMOSET POLYMERS;

THERMOSETS;

EID: 28044441669     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2005.07.016     Document Type: Article

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