Studies on the thermionic vacuum arc discharges in the vapors of Cu-Ag and Cu-Sn alloys

Journal of Optoelectronics and Advanced Materials

Volumn 7, Issue 5, 2005, Pages 2489-2494

  Akan, T ^a   Ekem, N ^a   Pat, S ^a   Vladoiu, R ^b   Musa, G ^c  

^a ESKISEHIR OSMANGAZI UNIVERSITY   (Turkey)

^b OVIDIUS UNIVERSITY   (Romania)

^c NATIONAL INSTITUTE FOR LASER   (Romania)

Author keywords

Cu Ag and Cu Sn alloys; Thermionic vacuum arc; Thin films

Indexed keywords

BINARY ALLOYS; COBALT ALLOYS; COBALT METALLOGRAPHY; COPPER ALLOYS; GOLD ALLOYS; GOLD METALLOGRAPHY; SILVER ALLOYS; SILVER METALLOGRAPHY; SUBSTRATES; THERMIONIC POWER GENERATION; THIN FILMS; TIN ALLOYS; TIN METALLOGRAPHY; TITANIUM ALLOYS; TITANIUM METALLOGRAPHY; VACUUM APPLICATIONS; VACUUM TECHNOLOGY;

BOILING TEMPERATURE; CU-AG ALLOYS; CU-SN ALLOYS; GLASS SUBSTRATES; MASS RATIO; METAL VAPOR; THERMIONIC VACUUM ARC; VOLT-AMPERE CHARACTERISTICS;

COPPER METALLOGRAPHY;

EID: 27844553861     PISSN: 14544164     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

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