Variation in thickness of copper films deposited at various distances and angles using the thermionic vacuum arc

Turkish Journal of Physics

Volumn 27, Issue 3, 2003, Pages 219-224

  Akan, Tamer ^a   Ekem, Naci ^a  

^a ESKISEHIR OSMANGAZI UNIVERSITY   (Turkey)

Author keywords

Anodic vacuum arc; Copper vapor plasma; Deposition; Thickness

Indexed keywords

ADHESION; DEPOSITION; ELECTRON BEAMS; POSITIVE IONS;

THERMIONIC VACUUM ARC;

THIN FILMS;

EID: 0038749428     PISSN: 13000101     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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