Adhesive metal films obtained by thermionic vacuum arc (TVA) deposition

Thin Solid Films

Volumn 333, Issue 1-2, 1998, Pages 95-102

  Ehrich, H ^a   Schuhmann, J ^a   Musa, G ^b   Popescu, A ^b   Mustata, I ^b  

^a UNIVERSITY OF DUISBURG ESSEN   (Germany)

^b INSTITUTE OF ATOMIC PHYSICS   (Romania)

Author keywords

Copper; Metallization; Physical vapor deposition (PVD); Plasma processing and deposition

Indexed keywords

COPPER; METALLIZING; PLASMA APPLICATIONS; THERMIONIC EMISSION; VACUUM DEPOSITED COATINGS; VAPOR DEPOSITION;

PHYSICAL VAPOR DEPOSITION; THERMIONIC VACUUM ARC DEPOSITION;

THIN FILMS;

EID: 0032206464     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)00842-6     Document Type: Article

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