Laser direct exposure of photodefinable polymer masks using shaped-beam optics

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 4, 2005, Pages 312-321

  Corbett, Scott ^a   Strole, Jeff ^a,b   Johnston, Kyle ^a   Swenson, Edward J ^c   Lu, Weixiong ^c  

^a MicroConnex   (United States)

^b Metron Systems Inc   (United States)

^c Electro Scientific Industries Inc   (United States)

Author keywords

Direct write; Photoimageable resist; Ultraviolet (UV) laser

Indexed keywords

CONTINUOUS WAVE LASERS; IMAGING TECHNIQUES; LASER ABLATION; LASER APPLICATIONS; LASER BEAMS; MATHEMATICAL MODELS; OPTICS; PHOTOLITHOGRAPHY; PHOTORESISTS; POLYMERS;

PHOTODEFINABLE POLYMER MASKS; PHOTOIMAGEABLE RESIST; SHAPED BEAM OPTICS; ULTRAVIOLET (UV) LASER;

PRINTED CIRCUIT BOARDS;

EID: 27844480616     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.857662     Document Type: Article

References (11)

1. M. Ehsani and M. Kesler, "Lasers speed up board production," IEEE Spectrum, vol. 37, no. 5, pp. 43-45, May 2000.
2. A. Piqué and D. B. Chrisey, Direct Write Technologies for Rapid Prototyping Applications: in Sensors, Electronics and Integrated Power Sources. New York: Academic, 2001.
3. D. J. Meier et al., "Laser structuring of fine lines," in Proc. 5th Annu. National Conf. Flexible Circuits, Denver, CO, 1999, pp. 94-101.
4. S. Corbett, "Flexible circuit array-area interconnection for biomedical sensors. MEMS systems and chip array interconnection," in Proc. IPC 7th Annu. National Conf. Flexible Circuits, Fremont, CA, 2001, pp. 123-138.
5. E. Swenson and Y. Sun, "New laser processing techniques for thick & thin-film circuit manufacturing," in Proc IMAPS Int. Symp. Microelectronics, San Diego, CA, Oct. 1998, pp. 937-943.
6. E. Swenson, Y. Sun, and C. Dunsky, "Laser micromachining in electronics manufacturing a historical overview," Proc SPIE, vol. 4095, pp. 118-132, Jul. 2000.
7. S. Corbett et al., "A high-density, Resin-Coated-Foil (RCF) substrate utilizing mask and direct-write UV laser photolithography," in Proc. Int. Conf. Exhibition High Density Interconnect and Systems Packaging, Santa Clara, CA, Apr. 2001, pp. 352-357.
8. W. Beck et al., "Direct write exposure and ablation of photo-resist in fine scale interconnect circuits," presented at the Saratov Fall Meeting 2000, vol. 4243, Proc. SPIE, V. Derbov et al., Eds., Saratov, Russia, 2001, pp. 1-8. Published in SFM 2000: Laser Physics and Photonics; and Spectroscopy and Molecular Modeling.
9. C. Dunsky, "Microvia formation with UV solid-state lasers," in Proc. IEEE, Special Issue on Lasers in Microelectronics and Manufacuring, vol. 90, Oct. 2002, pp. 1670-1680.
10. F. Dickey and S. Holswade, Eds., Laser Beam Shaping: Theory and Techniques. New York: Marcel Dekker, 2000.
11. Technical Data Sheet, Photoposit SP24, PI-109 002, Shipley Inc. (2005). http://www.chestech.co.uk/sp24flyer.pdf [Online]