Direct write exposure and ablation of photo-resist in fine scale interconnect circuits

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4243, Issue , 2001, Pages 1-8

  Beck, William A ^a   Strole, Jeff ^a   Yarno, John ^a   Hughes, Thayer ^a,b   Ross, Ben ^a  

^a MicroSound Systems   (United States)

^b Enerdyne Solutions Inc   (United States)

Author keywords

Direct write laser imaging; High density flex; High density interconnect; Laser ablation; Laser micro machining

Indexed keywords

IMAGING TECHNIQUES; LASER ABLATION; LASER OPTICS; PRINTED CIRCUIT BOARDS;

LASER MICRO-MACHINING;

PRINTED CIRCUIT DESIGN;

EID: 0034941155     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.426675     Document Type: Article

References (0)