Roller-type gravure offset printing of conductive inks for high-resolution printing on ceramic substrates

International Journal of Electronics

Volumn 92, Issue 5, 2005, Pages 251-269

  Pudas, M ^a   Hagberg, J ^a   Leppavuori S ^a  

^a UNIVERSITY OF OULU   (Finland)

Author keywords

Ceramics; Conductive inks; Gravure offset; Inductor coil; Intaglio; Interdigital capacitor; Pad printing; Printing; Thick films

Indexed keywords

CAPACITORS; CERAMIC MATERIALS; ELECTRIC INDUCTORS; INK; LASER BEAM EFFECTS;

CONDUCTIVE INKS; GRAVURE OFFSET; INDUCTOR COIL;

OFFSET PRINTING;

CAPACITORS; CERAMICS; GRAVURE PRINTING; INK; OFFSET PRINTING; PAD PRINTING;

EID: 27744570214     PISSN: 00207217     EISSN: 13623060     Source Type: Journal    
DOI: 10.1080/00207210500102930     Document Type: Article

References (25)

1. D.I. Amey and S.J. Horowitz, "Microwave characterization of packaging materials. Advanced Packaging Materials", in Proceedings of the 3rd International Symposium on, 1997, p. 158.
2. D.K. Anderson, J. Oleksyn, M. Batson and J. Cocker, "The use of thick print copper and silver conductors for power applications", Microelectronics International, 18, p. 31, 2001.
3. L. Balents, K. Christopher and D. Skoczylas, "Plated copper on ceramic manufacturing technology advances into RF and CSP assembly systems", in Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT, 1999, p. 294.
4. Y.A. Bery, "Mechanism governing gravure printing", in Prog. TAPPI-Coating Conference, 1985, p. 149.
5. M. Gaynes, R. Kodnani, M. Pierson, P. Hoontrakul and M. Paquette, Flip chip attach with thermoplastic electrically conductive adhesive, "Adhesive Joining and Coating Technology in Electronics Manufacturing", in Proceedings of 3rd international Conference on, 1998, p. 244.
6. V. Golovanov, J.L. Solis, V. Lantto and S. Leppävuori, "Different thick-film methods in printing of one-electrode semiconductor gas sensors", Sensors and Actuators B: Chemical, 34(1-3), p. 401, 1996.
7. J. Hagberg and S. Leppävuori, "Method for the manufacture of high quality gravure plates for printing fine line electrical circuits", in Conference on Device and Process Technologies for MEMS and Microelectronics, Vol. SPIE 3892, Royal Pines Resort Queensland, Australia, 1999, p. 313.
8. J. Hagberg, M. Pudas, S. Leppävuori, K. Elsey and A. Logan, "Gravure offset printing development for fine line thick film circuits", Microelectronics International, 18(3), p. 32, 2001.
9. H.W. Ireland, R.L. Farrar, E.F. Smith III and R. Cooper, "Reliability improvements for an automotive fuel level sensor", in Proceedings of the Forty-Sixth IEEE Holm Conference on Electrical Contacts, 2000, p. 216.
10. S.E. Kistler and P.M. Schweizer, Liquid Film Coating, London: Chapman & Hall, 1997, 1st edn, Chap 5., pp. 157-179.
11. K. Kordás, A.E. Pap, M. Pudas, J. Jääskeläinen, A. Uusimäki and S. Leppävuori, "Laser soldering; a novel approach", Optics and Lasers in Engineering, 2004 (submitted).
12. M. Lahti, V. Lantto and S. Leppävuori, "Realisation of buried passive components in low-temperature co-fired ceramic materials by thick-film techniques", Advanced Electronics Packaging, 26(2), p. 1369, 1999.
13. M. Lahti, V. Lantto and S. Leppävuori, "Planar inductors on an LTCC substrate realized by the gravure-offset-printing technique", IEEE Translations on Components and Packaging Technologies, 23, p. 606, 2000.
14. M. Lahti, S. Leppävuori and V. Lantto, "Gravure-offset-printing technique for the fabrication of solid films", Applied Surface Science, 142, p. 367, 1999.
15. K. Mizuno, "Printing color filter for active matrix liquid-crystal display colour filter", Japanese Journal of Applied Physics, 30, p. 3313, 1991.
16. K. Nakao, M. Hayama, K. Kuramasu, M. Shimada and M. Tsukamoto, "Giant microelectronics technology using gravure printing techniques", in Extended Abstract, 1991 International Conference on Solid State Devices and Materials, Yokomo, Japan, 1991, p. 599.
17. M. Pudas, J. Hagberg and S. Leppävuori, "The absorption ink transfer mechanism of gravure offset printing for electronic circuitry", IEEE Transactions on Electronics Packaging Manufacturing, 25, p. 335, 2002a.
18. M. Pudas, J. Hagberg, S. Leppävuori, K. Elsey and A. Logan, "Methods for evaluation of fine-line circuitry printing inks", in IMAPS 2002 conference, Cracow, 33, Coloration Technology, 120(3), 119-126, 2004.
19. M. Pudas, J. Hagberg and S. Leppävuori, "Gravure offset printing of polymer inks for conductors", Progress in organic coatings, 49(4), 324-335, 2004.
20. M. Pudas, J. Hagberg and S. Leppävuori, "Printing parameters and ink components affecting to ultra-fine-line gravure-offset printing for electronics applications", in Journal of the European Ceramic Society, 24(10-11), 2943-2950, September 2004.
21. M. Pudas, J. Hagberg and S. Leppävuori, "The self-cleaning gravure (SCG), a solution for gravure groove blocking and a novel printing method", The Journal of Imaging Science and Technology, 48(4), 374-380, July/August, 2004.
22. W. Qu and J.-U. Meyer, "A novel thick-film ceramic humidity sensor", Sensors and Actuators B: Chemical, 40(2-3), p. 175, 1997.
23. M. Shimada, H. Watanabe, M. Tsukamoto and T. Ishida, "Manufacturing of fine-line films by printing technique", in Proc. IMC 1990. Tokyo, Japan, 1990, p. 581.
24. S.J. Stein, R.L. Wahlers, C.Y.D. Huang and M.A. Stein, "Interconnection and packaging of advanced electronic circuitry", in Proceeding of the ISHM Conference, Orlando, FL, USA, 1991, p. 130.
25. R.B. Tait, R. Humphries and J. Lorenz, "Thick film heater elements and temperature sensors in modern domestic appliances", Industry Applications, IEEE Transactions on, 1994, 30, p. 573.