Plated copper on ceramic manufacturing technology advances into RF and CSP assembly systems

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 294-303

  Balents, Leon ^a   Christopher, Ken ^a   Skoczylas, Dan ^a  

^a Zecal Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CERAMIC MATERIALS; COST EFFECTIVENESS; ELECTRONICS PACKAGING; ELECTROPLATING; FIRING (OF MATERIALS);

CHIP SCALE PACKAGES (CSP);

COPPER PLATING;

EID: 0033323386     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)