Low temperature epoxy-free and flux-less bonding process applied to solid-state microchip laser

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5825, Issue , 2005, Pages 602-608

  Kopp, Christophe ^a   Gilbert, Karen ^a  

^a CEA GRENOBLE   (France)

Author keywords

Assembling; Integration; Packaging; Thermocompression

Indexed keywords

ACTIVE COMPONENTS; BONDING TECHNOLOGY; EPOXY FREE BONDING; FLUX-LESS BONDING;

BONDING; EPOXY RESINS; FLUXES; INTERDIFFUSION (SOLIDS); OPTOELECTRONIC DEVICES; SEMICONDUCTOR LASERS; SOLDERING;

SOLID STATE LASERS;

EID: 27644557648     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.594551     Document Type: Conference Paper

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