Gold to gold thermosonic flip-chip bonding

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4428, Issue , 2001, Pages 165-170

  Cheah, L K ^a   Tan, Y M ^a   Wei, J ^a   Wong, C K ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Flip chip and thermosonic bonding; Fluxless process; Lead free

Indexed keywords

ASSEMBLY; BOND STRENGTH (MATERIALS); BONDING; DEFORMATION; ELECTRONICS PACKAGING; GOLD; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THERMAL CYCLING;

CONDUCTIVE ADHESIVE FILMS ASSEMBLY METHOD; FLIP CHIP BONDING; THERMOSONIC BONDING;

FLIP CHIP DEVICES;

EID: 0034838105     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Modeling and experiment studies on thermosonic flip chip bonding
2. Thermosonic bonding of an optical transceiver based on 8 × 8 cavity surface emitting laser array