A MEMS active cooling substrate for microelectronics thermal management

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 461-463

  Wang, Yong ^a   Yuan, Guang ^a   Yoon, Yong Kyu ^a   Allen, Mark G ^a   Bidstrup, Sue Ann ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COOLING; ELECTRIC WIRING; ENERGY UTILIZATION; MICROELECTROMECHANICAL DEVICES; PRINTED CIRCUIT BOARDS; THERMAL EFFECTS;

ACTIVE COOLING SUBSTRATES (ACS); THERMAL MANAGEMENT;

MICROELECTRONICS;

EID: 1942440317     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-42799     Document Type: Conference Paper

References (3)

1. Gelsinger, P. P., 2001,"Microprocessors for the Millennium: Challenges, Opportunities, and New Frontiers," Proc., 2001 IEEE International Solid-State circuits Conference, pp.22-25.
2. Smith, B.L., and Glezer, A., 1998, "The formation and revolution of synthetic jets," Phys. Fluids, 10, pp. 2281-2297.
3. Sedra, A.S., and Smith, K.C., 1998, Microelectronic Circuits, Oxford University Press, Oxford, NY.