Control the shape and curvature of micromachined cantilever using multiple plasma chemistry bonding technology

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 2, Issue , 2005, Pages 2019-2022

  Su, Wang Shen ^a   Lee, Sheng Ta ^a   Lin, Cheng Yu ^a   Fang, Weileun ^a   Tsai, Ming Shih ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

Author keywords

Cantilever beam; Curvature; Plasma; Shape

Indexed keywords

COMPUTER SIMULATION; DEFLECTION YOKES; MICROMACHINING; PLASMAS; SOLID STATE DEVICES; SURFACE TREATMENT; THIN FILMS; TUNING;

CURVATURES; MICROMACHINED CANTILEVERS; PLASMA SURFACE MODIFICATIONS; PLASMA TREATMENTS; SHAPES;

SILICA;

EID: 27544492253     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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