Young's modulus of moulding compounds measured with a resonance method

Polymer Testing

Volumn 24, Issue 2, 2005, Pages 197-203

  Schmidt, Roland ^a   Wicher, Viktor ^a   Tilgner, Rainer ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Impulse excitation technique; Microelectronic devices; Moulding compound; Young's modulus

Indexed keywords

BENDING (DEFORMATION); ELASTIC MODULI; ELECTRIC EXCITATION; ENCAPSULATION; MECHANICAL PROPERTIES; MICROELECTRONICS; RESONANCE; STRESS ANALYSIS;

IMPULSE EXCITATION TECHNIQUES; MICROELECTRONIC DEVICES; MOISTURE STORAGE; STRESS TESTS;

SHEET MOLDING COMPOUNDS;

EID: 27544462544     PISSN: 01429418     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymertesting.2004.08.010     Document Type: Article

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