Multi-scale compliant structures for use as a chip-scale dry adhesive

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 2, Issue , 2005, Pages 2044-2047

  Northen, Michael T ^a   Turner, Kimberly L ^a  

^a University of California   (United States)

Author keywords

3 D MEMS; Dry adhesive; Nanoindenter; Nanorod

Indexed keywords

3-D MEMS; DRY ADHESIVES; NANOINDENTERS; NANORODS;

ADHESIVES; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; POLYMERS; SILICON; VAN DER WAALS FORCES; WEAR OF MATERIALS;

CHIP SCALE PACKAGES;

EID: 27544454675     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2005.1497504     Document Type: Conference Paper

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