Average power handling capability of finite-ground thin-film microstrip lines over ultra-wide frequency ranges

IEEE Microwave and Wireless Components Letters

Volumn 15, Issue 10, 2005, Pages 715-717

  Yin, Wen Yan ^a,b   Dong, X T ^a,c   Mao, Junfa ^a,b   Li, Le Wei ^a,c  

^a IEEE   (China)

^b SHANGHAI JIAO TONG UNIVERSITY   (China)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Attenuation constant; Average power handling capability (APHC); Benzocyclobutene (BCB); Distributed pa rameters; Finite ground thin film microstrip lines (FG TFMLs); Thermal conductivity

Indexed keywords

ATTENUATION CONSTANT; AVERAGE POWER HANDLING CAPABILITIES (APHC); BENZOCYCLOBUTENE (BCB); DISTRIBUTED PARAMETERS; THIN-FILM MICROSTRIP LINES (TFML);

METALLIZING; PLASTIC FILMS; POLYIMIDES; THERMAL CONDUCTIVITY; THIN FILMS;

MICROSTRIP LINES;

EID: 27144469010     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2005.856829     Document Type: Article

References (7)

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