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Volumn , Issue , 2005, Pages 504-507

Towards a versatile DRIE: Silicon pit structures combined with electrochemical etch stop

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTROCHEMISTRY; PITTING; SENSORS; SILICON; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

EID: 26844551736     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (2)

References (9)
  • 1
    • 0036601273 scopus 로고    scopus 로고
    • Effect of process parameters on the surface morphology and mechanical performance of silicon structures after Deep Reactive Ion Etching (DRIE)
    • K.-S. Chen, A. A. Ayon, X. Zhang, and M. S. Spearing, "Effect of Process Parameters on the Surface Morphology and Mechanical Performance of Silicon Structures after Deep Reactive Ion Etching (DRIE)", Journal of Microelectromechanical Systems, vol. 11, pp. 264-275, 2002
    • (2002) Journal of Microelectromechanical Systems , vol.11 , pp. 264-275
    • Chen, K.-S.1    Ayon, A.A.2    Zhang, X.3    Spearing, M.S.4
  • 2
    • 26844574559 scopus 로고
    • U.S. Pat. 4855017 and 4 784 720, Germany Pat. 4 241 045 C1
    • Robert Bosch GmbH, U.S. Pat. 4855017 and 4 784 720, Germany Pat. 4 241 045 C1, 1994
    • (1994)
  • 3
    • 0018030427 scopus 로고
    • Anisotropic etching of silicon
    • K. E. Beam, "Anisotropic etching of Silicon", IEEE Trans. Electron Devices, vol.25, pp. 1185-1193, 1978
    • (1978) IEEE Trans. Electron Devices , vol.25 , pp. 1185-1193
    • Beam, K.E.1
  • 6
    • 0342955717 scopus 로고    scopus 로고
    • An Industrial CMOS process family adapted for the fabrication of smart silicon sensors
    • T. Mueller, M. Brandl, O. Brand, and H. Baltes, "An Industrial CMOS Process Family Adapted for the Fabrication of Smart Silicon Sensors", Sensors and Actuators, A Physical, vol. 84, pp. 126-133, 2000
    • (2000) Sensors and Actuators, A Physical , vol.84 , pp. 126-133
    • Mueller, T.1    Brandl, M.2    Brand, O.3    Baltes, H.4
  • 7
    • 0024647478 scopus 로고
    • Study of electrochemical etch-stop for high-precision thickness control of silicon membranes
    • B. Kloeck, S. D. Collins, N. F. de Rooij, and R. I. Smith, "Study of Electrochemical Etch-Stop for High-Precision Thickness Control of Silicon Membranes", Transaction on Electron Devices, vol. 36(4), pp. 663-669, 1989
    • (1989) Transaction on Electron Devices , vol.36 , Issue.4 , pp. 663-669
    • Kloeck, B.1    Collins, S.D.2    De Rooij, N.F.3    Smith, R.I.4
  • 9
    • 3042699996 scopus 로고    scopus 로고
    • Fabrication of 3D microstructures and microactuators on (100) SOI wafer using the DAWN process
    • Maastricht
    • H.-Y. Chu and W. Fang, "Fabrication of 3D Microstructures and Microactuators on (100) SOI Wafer Using the DAWN Process", Tech. Digest of MEMS Conference 2004, Maastricht, 2004, pp. 253-256
    • (2004) Tech. Digest of MEMS Conference 2004 , pp. 253-256
    • Chu, H.-Y.1    Fang, W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.