A simplified model of the reflow soldering process

Soldering and Surface Mount Technology

Volumn 14, Issue 1, 2002, Pages 30-37

  Whalley, David C ^a   Hyslop, Stuart M ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Reflow; Soldering

Indexed keywords

CALCULATIONS; COMPUTER WORKSTATIONS; FURNACES; HEAT CONVECTION; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY; TWO DIMENSIONAL; UNIX;

REFLOW FURNACE; REFLOW SOLDERING; THERMAL MASSES;

SOLDERING;

EID: 0036237201     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910210416440     Document Type: Article

References (6)

1. A detailed thermal model of the infrared reflow soldering process
2. Modelling the transient thermal experience of large pieces of vitreous china ware during firing
3. Increasing reflow process efficiency and yield with automated reflow setup
4. Effective modelling of the reflow soldering process: Basis, construction and operation of a process model
5. The process modelling of the infra-red reflow soldering of printed circuit board assemblies
6. Thermal modelling of temperature development during the reflow soldering of SMD Assemblies