Low temperature properties of PI/SiO2 nanocomposite films

Materials Science and Engineering: B

Volumn 123, Issue 3, 2005, Pages 216-221

  Wang, Z D ^a,c   Lu, J J ^a   Li, Y ^b   Fu, S Y ^b   Jiang, S Q ^a   Zhao, X X ^a  

^a BEIJING JIAOTONG UNIVERSITY   (China)

^b TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

^c INSTITUTE OF MECHANICS   (China)

Author keywords

Coefficient of thermal expansion (CTE); Film; Low temperature; Mechanical properties

Indexed keywords

DOPING (ADDITIVES); ELASTIC MODULI; NANOSTRUCTURED MATERIALS; POLYIMIDES; SILICA; TENSILE STRENGTH; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION (CTE); FILM; LOW TEMPERATURE;

METALLIC FILMS;

EID: 25844470393     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2005.08.086     Document Type: Article

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