Predicting three-dimensional solder joint shapes of SMT based on minimal energy principle

Tien Tzu Hsueh Pao/Acta Electronica Sinica

Volumn 27, Issue 5, 1999, Pages 66-68

  Zhou, Dejian ^a   Pan, Kailin ^a   Wu, Zhaohua ^a   Chen, Zichen ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

MATHEMATICAL MODELS; SOLDERED JOINTS;

MINIMAL ENERGY PRINCIPLE; SOLDER JOINT SHAPES;

SURFACE MOUNT TECHNOLOGY;

EID: 0033123809     PISSN: 03722112     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)