Photoresist ashing in nitrogen gas using ferrite core inductively coupled plasmas

Vacuum

Volumn 80, Issue 1-3, 2005, Pages 193-197

  Kim, Hyoun Woo ^a   Myung, Ju Hyun ^a   Kim, Nam Ho ^a   Chung, Chin Wook ^b   Park, Wan Jae ^c   Kang, Chang Jin ^c   Yoo, Chung Gon ^d   Choi, Dae Kyu ^d  

^a Inha University   (South Korea)

^b Hanyang University   (South Korea)

^c SAMSUNG Electronics   (South Korea)

^d New Power Plasma Co Ltd   (South Korea)

Author keywords

Ferrite core HF plasmas; Low k material; Plasma ashing

Indexed keywords

DIELECTRIC MATERIALS; ETCHING; FERRITE; FLOW OF FLUIDS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; INDUCTIVELY COUPLED PLASMA; NITROGEN;

ETCH TEST; FERRITE CORE HF PLASMA; LOW-K MATERIAL; PLASMA ASHING;

PHOTORESISTS;

EID: 25444513107     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.vacuum.2005.08.009     Document Type: Conference Paper

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