Fabrication of carbon nanotube devices by electroplating with in situ observation

Microelectronic Engineering

Volumn 73-74, Issue , 2004, Pages 559-563

  Wakaya, F ^a   Ogi, Y ^a   Yoshida, M ^a   Kimura, S ^a   Takai, M ^a   Akasaka, Y ^a   Gamo, K ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Carbon nanotube; Contact resistance; Electroplating

Indexed keywords

CARBON NANOTUBES; ELECTRIC CONDUCTANCE; ELECTRON BEAM LITHOGRAPHY; ELECTROPLATING; EVAPORATION; GRAPHITE; IN SITU PROCESSING; LOW TEMPERATURE OPERATIONS; NETWORKS (CIRCUITS); OHMIC CONTACTS; SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

AC VOLTAGES; CONTACT RESISTANCE; MULTIWALL CARBON NANOTUBES (MWNT); SINGLE-ELECTRON RESISTORS;

MICROELECTRONICS;

EID: 2542427937     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(04)00139-X     Document Type: Conference Paper

References (11)

1. Iijima S. Nature. 354:1991;56.
2. Anantram M.P., Datta S., Xue Y. Phys. Rev. B. 61:2000;14219.
3. Nakanishi T., Ando T. J. Phys. Soc. Jpn. 69:2000;2175.
4. Andriotis A.N., Menon M., Froudakis G.E. Appl. Phys. Lett. 76:2000;3890.
5. Bachtold A., Henny M., Terrier C., Strunk C., Schrönenberger C., Salvetat J.-P., Bonard J.-M., Forró L. Appl. Phys. Lett. 73:1998;274.
6. Kanda A., Ootuka Y., Tsukagoshi K., Aoyagi Y. Appl. Phys. Lett. 79:2001;1354.
7. Wakaya F., Katayama K., Gamo K. Microelectron. Eng. 67-68:2003;853.
8. Bezryadin A., Verschueren A.R.M., Tans S.J., Dekker C. Phys. Rev. Lett. 80:1998;4036.
9. Morpurgo A.F., Marcus C.M., Robinson D.B. Appl. Phys. Lett. 74:1999;2084.
10. Frank S., Poncharal P., Wang Z.L., de Heer W.A. Science. 280:1998;1744.
11. de Pablo P.J., Gómez-Navarro C., Colchero J., Serena P.A., Gómez-Herrero J., Baró A.M. Phys. Rev. Lett. 88:2002;036804.