Full-field feature profile models in process control

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5755, Issue , 2005, Pages 126-137

  Zavecz, Terrence E ^a  

^a TEA Systems   (United States)

Author keywords

Aberration; BARC; BCD; Duty Cycle; K1; Lens; Lithography; Metrology; Model; Perturbation; Process control; Process window; Profile; Resist; Scanner; Scatterometry; SEM; Semiconductor; Side Wall Angle; Slit; SWA; Wafer; Weir PW

Indexed keywords

LENS; MODEL; PERTURBATION; PROFILE; SCANNER; SCATTEROMETRY; SEMICONDUCTOR; SIDE-WALL-ANGLE; SWA; WAFER;

ABERRATIONS; ELECTROMAGNETIC WAVE SCATTERING; MEASUREMENT ERRORS; PERTURBATION TECHNIQUES; PHOTOLITHOGRAPHY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR MATERIALS;

PROCESS CONTROL;

EID: 25144477832     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.600240     Document Type: Conference Paper

References (7)

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