Integrating DfM components into a cohesive design-to-silicon solution

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5756, Issue , 2005, Pages 1-12

  Liebmann, Lars ^a   Maynard, Dan ^a   McCullen, Kevin ^a   Seong, Nakgeuon ^a   Buturla, Ed ^a   Lavin, Mark ^b   Hibbeler, Jason ^a  

^a IBM   (United States)

^b IBM RESEARCH   (United States)

Author keywords

Critical area analysis (CAA); Design for manufacturability (DfM); Glyph based layout; Physical design characterization (PDC); Resolution enhancement techniques (RET); Restricted design rules (RDR)

Indexed keywords

LITHOGRAPHY; OPTIMIZATION; PRODUCT DESIGN;

CRITICAL AREA ANALYSIS (CAA); DESIGN FOR MANUFACTURABILITY (DFM); PHYSICAL DESIGN CHARACTERIZATION (PDC); RESOLUTION ENHANCEMENT TECHNIQUES (RET); RESTRICTED DESIGN RULES (RDR);

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 25144433780     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.604723     Document Type: Conference Paper

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