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Volumn , Issue , 2004, Pages 2-10

Reliability and yield: A joint defect-oriented approach

Author keywords

[No Author keywords available]

Indexed keywords

PARAMETRIC DEFECTS; SOPT DEFECTS; UNIDIRECTIONAL CURRENT STRESS;

EID: 24944523442     PISSN: 15505774     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DFTVS.2004.1347819     Document Type: Conference Paper
Times cited : (4)

References (14)
  • 4
    • 0022792790 scopus 로고
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    • H. Walker and S. W. Director. VLASIC: A catastrophic fault yield simulator for integrated circuits. IEEE Transactions on CAD, 5(4):541-556, October 1986.
    • (1986) IEEE Transactions on CAD , vol.5 , Issue.4 , pp. 541-556
    • Walker, H.1    Director, S.W.2
  • 6
    • 0026869428 scopus 로고
    • Ic defect sensitivity for footprint type spot defects
    • May
    • J. Pineda de Gyvez and C. Di. Ic defect sensitivity for footprint type spot defects. IEEE Transactions on CAD, 11(5):638-658, May 1992.
    • (1992) IEEE Transactions on CAD , vol.11 , Issue.5 , pp. 638-658
    • De Gyvez, J.P.1    Di, C.2
  • 8
    • 0031996656 scopus 로고    scopus 로고
    • Critical area extraction for soft fault estimation
    • February
    • Gerard A. Allan and Anthony J.Walton. Critical area extraction for soft fault estimation. IEEE Trans. on Semiconductor Manufacturing, 11(1):146-154, February 1998.
    • (1998) IEEE Trans. on Semiconductor Manufacturing , vol.11 , Issue.1 , pp. 146-154
    • Allan, G.A.1    Walton, A.J.2
  • 10
    • 0026905255 scopus 로고
    • On the assumptions contained in semiconductor yield models
    • Aug
    • Albert V. Ferris-Prabhu. On the assumptions contained in semiconductor yield models. IEEE Transactions on Computer-Aided Design, 11(8):966-975, Aug 1992.
    • (1992) IEEE Transactions on Computer-aided Design , vol.11 , Issue.8 , pp. 966-975
    • Ferris-Prabhu, A.V.1
  • 12
    • 0014630193 scopus 로고
    • Electromigration failure models in aluminium metallization for semiconductor devices
    • J. R. Black. Electromigration failure models in aluminium metallization for semiconductor devices. Proc. Of the IEEE, 57(9):1587-1594, 1969.
    • (1969) Proc. of the IEEE , vol.57 , Issue.9 , pp. 1587-1594
    • Black, J.R.1
  • 13
    • 0021466353 scopus 로고
    • Modeling of defects in integrated circuit photolithographic patterns
    • Jul
    • C. H. Stapper. Modeling of defects in integrated circuit photolithographic patterns. IBM Journal of Research and Development, 28(4):461-475, Jul 1984.
    • (1984) IBM Journal of Research and Development , vol.28 , Issue.4 , pp. 461-475
    • Stapper, C.H.1
  • 14
    • 0029410204 scopus 로고
    • Modeling electromigration lifetime under bidirectional current stress
    • Nov.
    • Jiang Tao, Nathan W. Cheung, and Chenming Hu. Modeling electromigration lifetime under bidirectional current stress. Electron Device Letters, 16(11):476-556, Nov. 1995.
    • (1995) Electron Device Letters , vol.16 , Issue.11 , pp. 476-556
    • Tao, J.1    Cheung, N.W.2    Hu, C.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.