Ductile mode machining of hard-brittle materials under high hydrostatic pressure (2nd report) - Machining test of hard-brittle materials under high hydrostatic pressure;Ductile mode machining of hard-brittle materials under high hydrostatic pressure (2nd report) - Machining test of hard-brittle materials under high hydrostatic pressure

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

Volumn 68, Issue 10, 2002, Pages 1351-1355

  Yoshino, Masahiko ^a   Kitamura, Gen ^a   Ogawa, Yasufumi ^a  

^a NONE

Author keywords

Cutting force; Damage free machining; Glass; Hard brittle material; High hydrostatic pressure; Load cell; Machining; Machining defect; Quartz; Quartz glass; Silicon

Indexed keywords

DUCTILITY; GLASS; HYDROSTATIC PRESSURE; LASERS; MACHINING; MICROSCOPES; QUARTZ; SILICON;

CUTTING FORCE; DAMAGE FREE MACHINING; HARD-BRITTLE MATERIALS;

BRITTLENESS;

EID: 24944520687     PISSN: 09120289     EISSN: None     Source Type: Journal    
DOI: 10.2493/jjspe.68.1351     Document Type: Article

References (16)

1. Naga Chandrasekaran, Masahiko Yoshino, Takayuki Aoki, Ranga Komanduri: Micro crack-free scratching of silicon under external hydrostatic pressure, Proc. ASPE 2000 (Annual Meeting Scottsdate, Arizona), (2000), pp. 78-81.
2. M. Yoshino, T. Aoki T. Shirakashi and R. Komanduri: Some Experiments on the Scratching of Silicon -in situ scratching inside an SEM and scratching under high external hydrostatic pressures, J. Mechanical Science, 43 (2001) pp.335-347.
3. M. Yoshino, T. Aoki, N. Chandrasekaran, T. Shirakashi and R. Komanduri:Finite Element Simulation of Plane Strain Plastic-Elastic Indentation on Single Crystal Silicon, J. Mechanical Science, 43 (2001) pp.313-333.
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5. M. Yoshino, T. Aoki and T. Shirakashi: Scratching Test of Hard-brittle Materials under High Hydrostatic Pressure, trans. ASME, J. Manufacturing Science and Engineering, May (2001)
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