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1
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24944483704
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Mitglieder der Forschungsvereinigung 3-D MID e.V., 3D-MID Technologie Herstellungsverfahren, Gebrauchsanforderungen, Materialkennwerte, Carl Hanser Verlag, München
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Mitglieder der Forschungsvereinigung 3-D MID e.V., 3D-MID Technologie, Räumliche elektronische Baugruppen, Herstellungsverfahren, Gebrauchsanforderungen, Materialkennwerte, Carl Hanser Verlag, München, 2004.
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(2004)
Räumliche Elektronische Baugruppen
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2
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0036544046
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Innovative concept for the fabrication of micromechanical sensor and actuator devices using selectively metallized polymers
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W. Eberhardt, T. Gerhäußer, M. Giousouf, H. Kück, R. Mohr, and D. Warkentin Innovative concept for the fabrication of micromechanical sensor and actuator devices using selectively metallized polymers Sens. Actuators A 97-98 2002 473 477
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(2002)
Sens. Actuators A
, vol.97-98
, pp. 473-477
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Eberhardt, W.1
Gerhäußer, T.2
Giousouf, M.3
Kück, H.4
Mohr, R.5
Warkentin, D.6
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3
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24944551268
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MID technology to miniaturize electro-optical devices
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Erlangen, Germany, September 27-28
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H. Yamanaka, T. Suzuki, and S. Matsushima MID technology to miniaturize electro-optical devices Proceedings of the Fourth International Congress on Molded Interconnect Devices, MID 2000 Erlangen, Germany, September 27-28 2000 129 138
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(2000)
Proceedings of the Fourth International Congress on Molded Interconnect Devices, MID 2000
, pp. 129-138
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Yamanaka, H.1
Suzuki, T.2
Matsushima, S.3
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4
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3142721021
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Micro camera module with MID using flip-chip mounting technology
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Erlangen, Germany, September 25-26
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Y. Yagi, F. Harazono, and N. Ikegawa Micro camera module with MID using flip-chip mounting technology Proceedings of the Fifth International Congress on Molded Interconnect Devices, MID 2002 Erlangen, Germany, September 25-26 2002 99 107
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(2002)
Proceedings of the Fifth International Congress on Molded Interconnect Devices, MID 2002
, pp. 99-107
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Yagi, Y.1
Harazono, F.2
Ikegawa, N.3
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5
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85017525970
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Fabrication of an electrostatic miniature valve from metallized microinjection moulded polymers
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München, Germany, October 13-15
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M. Arnold, W. Eberhardt, M. Giousouf, H. Kück, G. Munz, M. Münch, M. Oprea, and D. Warkentin Fabrication of an electrostatic miniature valve from metallized microinjection moulded polymers Proceedings of the MICRO.tec 2003 München, Germany, October 13-15 2003 319 322
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(2003)
Proceedings of the MICRO.tec 2003
, pp. 319-322
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Arnold, M.1
Eberhardt, W.2
Giousouf, M.3
Kück, H.4
Munz, G.5
Münch, M.6
Oprea, M.7
Warkentin, D.8
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6
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84861247604
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Low cost accelerometers made from selectively metallized polymer
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Guimaraes, Portugal, September 21-24
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W. Eberhardt, H. Kück, R. Mohr, and D. Warkentin Low cost accelerometers made from selectively metallized polymer Proceedings of the Eurosensors XVII Guimaraes, Portugal, September 21-24 2003
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(2003)
Proceedings of the Eurosensors XVII
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Eberhardt, W.1
Kück, H.2
Mohr, R.3
Warkentin, D.4
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7
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84861238345
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Flipchip Klebetechnik auf MID
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HSG-IMAT, Stuttgart, Germany, October 10
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U. Keßler, W. Eberhardt, H. Kück, and U. Scholz Flipchip Klebetechnik auf MID Proceedings of the Workshop on Innovative Anwendungen der MID-Technik HSG-IMAT, Stuttgart, Germany, October 10 2003 7 18
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(2003)
Proceedings of the Workshop on Innovative Anwendungen der MID-Technik
, pp. 7-18
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Keßler, U.1
Eberhardt, W.2
Kück, H.3
Scholz, U.4
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8
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14844287007
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Adhesive technology for Flipchip assembly on moulded interconnect devices (MID)
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Shanghai, China, June 30-July 03
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U. Keßler, W. Eberhardt, and H. Kück Adhesive technology for Flipchip assembly on moulded interconnect devices (MID) Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Failure Analysis (HDP'04) Shanghai, China, June 30-July 03 2004 242 247
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(2004)
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Failure Analysis (HDP'04)
, pp. 242-247
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Keßler, U.1
Eberhardt, W.2
Kück, H.3
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