The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1468-1474

  Kwon, Woon Seong ^a   Yang, Se Young ^a   Lee, Soon Bok ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTRIC CONTACTS; FLIP CHIP DEVICES; LARGE SCALE SYSTEMS; STRESSES; THERMAL EXPANSION;

ANISOTROPIC CONDUCTIVE FILMS (ACF); COOLING DOWN PROCESSES; LINEAR ELASTICITY; THERMAL EXPANSION COEFFICIENT;

ADHESIVES;

EID: 24644516786     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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