Integrating system and feature scale models to study copper reflow

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 1, 1999, Pages 186-193

  Smy, T ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 24644485408     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. L. J. Friedrich, D. S. Gardner, S. K. Dew, M. Brett, arid T. Smy, J. Vac. Sci. Technol. B 15, 1780 (1997).
2. L. J. Friedrich, S. K. Dew, M. Brett, and T. Smy, Conference Proceedings ULSI XI 1996 (Materials Research Society, Pittsburgh, 1996), p. 621.
3. T. Smy, S. K. Dew, and M. J. Brett, MRS Bull. 20, 65 (1995).
4. L. J. Friedrich, S. K. Dew, M. Brett, and T. Smy, Thin Solid Films 266, 83 (1995).
5. S. K. Dew, T. Smy, and M. Brett, Jpn. J. Appl. Phys., Part 1 33, 1140 (1994).
6. L. E. Murr, Interfacial Phenomena in Metals and Alloys (Addison-Wesley, Reading, MA, 1975).
7. Abe, Y. Harada, and H. Onoda, in 1995 Proceedings of the VLSI Multilevel Interconnection Conference, edited by T. E. Wade (VMIC, Tampa, FL, 1995), p. 308.
8. T. Saito, N. Fukuda, H. Yamaguchi, S. Hirasaw, K. Hinode, and N. Owada, Advanced Metallization and Interconnect Systems for VLSI Applications in 1996, Conference Proceedings ULSI XII (Materials Research Society, Pittsburgh, 1997), p. 149.
9. J. N. Broughton, M. J. Brett, S. K. Dew, and G. Este, IEEE Trans. Semicond. Manuf. 9, 122 (1996).