Study of the copper reflow process using the GROFILMS simulator

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 15, Issue 5, 1997, Pages 1780-1787

  Friedrich, L J ^a   Gardner, D S ^b   Dew, S K ^a   Brett, M J ^a   Smy, T ^c  

^a UNIVERSITY OF ALBERTA   (Canada)

^b INTEL RESEARCH   (United States)

^c CARLETON UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5344257548     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.589525     Document Type: Article

References (17)

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