Novel Method for Wafer-Scale Packaging of Opto-electronic Devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5288, Issue , 2003, Pages 708-713

  Spencer, Daryl ^a   Malshe, Ajay P ^b,c   Foster, Ronald B ^a   O'Neal, Chad B ^a,c  

^a UNIVERSITY OF ARKANSAS   (United States)

^b University of Arkansas   (United States)

^c SYSCONN Corporation   (United States)

Author keywords

Through silicon via and anodic bonding; Wafer scale package

Indexed keywords

ANODIC BONDING; MICRO ELECTRO MECHANICAL SYSTEM (MEMS); THROUGH-SILICON-VIAS (TSV); WAFER-SCALE PACKAGE;

AMPLIFICATION; COSTS; ELECTRONICS PACKAGING; FIBER OPTICS; FLUIDICS; MICROELECTROMECHANICAL DEVICES; OPTICAL COMMUNICATION; PRODUCT DESIGN;

OPTOELECTRONIC DEVICES;

EID: 2342539809     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. J. Tatum, "VCSEL Packaging for Data Communication Transceiver Design," Fiber Optic Product News, 2000.
2. E. Peeters, "Challenges in Commercializing MEMS", IEEE Computational Science and Engineering, Vol. 4, No. 1, pp. 44-48, 1997, January-March 1997.
3. D. J. Monk and M. K. Shah, "Packaging and Testing Considerations of Bulk Micromachined, Piezoresistive Pressure Sensors", Motorola Sensor Products Division, Commercialization of Microsystems '96, pp. 136-149, 1996.
4. A. P. Malshe, C. O'Neal, S. B. Singh, W. D. Brown, W. P. Eaton and W. M. Miller, "Challenges in the Packaging of MEMS", International journal of Microcircuits and Electronic Packaging, Vol. 22, No. 3, pp. 236-237, Third Quarter 1999.
5. W. D. Brown, "Advanced Electronic Packaging: With emphasis on Multichip Modules", IEEE press, NY, pp. 8-10, 1999
6. nd edn. (Holt, Rinehart and Winston, New York 1976) Chap. 13.
7. Roithner Lasers Webpage, http://www.roithner-laser.com/VCSELs.html.
8. th International Conference on Solid State Sensors and Actuators, Digest of Technical papers, Vol. 1, pp. 232-235.