Residual-Stress Predictions in Polycrystalline Alumina

Journal of the American Ceramic Society

Volumn 84, Issue 3-12, 2001, Pages 2947-2954

  Vedula, Venkata R ^a,e   Glass, S Jill ^a   Saylor, David M ^b   Rohrer, Gregory S ^b   Carter, W Craig ^c   Langer, Stephen A ^d   Fuller Jr , Edwin R ^d  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b CARNEGIE MELLON UNIVERSITY   (United States)

^c Massachusetts Institute of Technology Cambridge   (United States)

^d NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^e UNITED TECHNOLOGIES RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CERAMIC MATERIALS; COOLING; CRYSTAL MICROSTRUCTURE; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; INTERFACIAL ENERGY; MICROCRACKING; POLYCRYSTALLINE MATERIALS; RESIDUAL STRESSES; TEMPERATURE; THERMAL EXPANSION;

CRYSTALLOGRAPHIC MISORIENTATION; POLYCRYSTALLINE ALUMINA; POLYCRYSTALLINE CERAMICS; THERMAL EXPANSION ANISOTROPY;

ALUMINA;

EID: 0035790329     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2001.tb01119.x     Document Type: Article

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